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Intel's Packaging Databook Chapter 2: Package/Module/PC Card Outlines

Chapter 2 Package / Module / PC Card Outlines and Dimensions: A detailed view of Intel package outlines and dimensions.

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Intel's Packaging Databook Chapter 10: Shipping and Transport Media

Packaging Databook, Ch. 10: product and transport media, environmental programs, tape and reel, protective bands, and shipping formats.

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Intel's Packaging Databook Chapter 12: Tape Carrier Package

Packaging Databook, Ch. 12: Profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.

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Intel's Packaging Databook Chapter 15: The Chip Scale Package (CSP)

Packaging Databook, Ch. 15: chip scale package, physical structure, electrical modeling, and performance.

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Intel® Itanium® Processors

Intel® Itanium® processors deliver robust performance and support today's most demanding business applications.

Xeon Processor E7-8800 Series DDR3 RDIMM Validation Results

Xeon Processor E7-8800 Series DDR3 RDIMM Validation Results

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Intel® E8870 Chipset Support Components

Vendor List: support components for E8870 Chipset-based system designs.

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Intel E8870 Chipset: Cost-Effectiveness for Scalable Servers

White Paper: Intel® E8870 Chipset has architecture for Intel Itanium® processor-based servers and allows systems to scale from 2-16 processors.

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Solve Power and Cooling Challenges for Effective Computing

White Paper: Intel® Xeon® and Intel® Itanium® processor-based servers scale effective computing capabilities and lower power and cooling costs.

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EFI Human Interface Infrastructure Specification v0.91

Defines core code for implementation of Human Interface Infrastructure of the Intel® Platform Innovation Framework for EFI.

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