Certifies that Intel Corporation—D1C in Hillsboro, Oregon, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and processes.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Guide to LGA1567 socket independent loading mechanism installation for minimized contact damage.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Demos processor insertion and removal with Intel® LGA771 Series and Intel® LGA775 Series sockets.