D1C ISO 9001:2008
Certifies that Intel Corporation—D1C in Hillsboro, Oregon, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and processes.
Read the full D1C ISO 9001:2008 Certification.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
Ensure consistent quality and minimize accidents with handling recommendations and practices.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.