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White Paper: PCB stack-up designs for Intel® architecture platforms meet high-speed needs and address the challenges of choosing materials, increasing speed, meeting industry standards, and reducing costs. (Dec. 2008)
Processor array reduces image resolution time for radar analytics. (v.1, Feb. 2011)
Ensure compliance regulations are met and minimize issues in the field. (Mar. 2012)
Tech leaders discuss the power of connecting billions of devices to extract greater big data insights.
Demonstrates attachment of strain gauges to measure manufacturing board flexure. (v.1, Jan. 2011)
Daikin Applied Transforming HVAC with IoT
Demonstrates how to use a USB drive to boot a customer reference board to DOS. (v.1, June 2010)