® Intel X58 Express Chipset

® 
Intel X58 Express Chipset

® Intel X58 Express Chipset

Thermal and Mechanical Design Guide November 2009 Document Number: 320840-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES... NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. ® The Intel X58 Express Chipset IOH may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2008-2009, Intel Corporation. 2 Thermal and Mechanical Design Guide Contents 1 2 3 4 5 A B C Introduction ..............................................................................................................7 1.1 Design Flow........................................................................................................7 1.2 Definition of Terms..............................................................................................8 1.3 Reference Documents ..........................................................................................8 Packaging Technology ...............................................................................................9 2.1 Non-Critical to Function Solder Joints ................................................................... 11 2.2 Package Mechanical Requirements....................................................................... 12 Thermal Specifications ............................................................................................ 13 3.1 Thermal Design Power (TDP) .............................................................................. 13 3.2 Case Temperature............................................................................................. 13 Thermal Metrology .................................................................................................. 15 4.1 Die Temperature Measurements.......................................................................... 15 4.1.1 Zero Degree Angle Attach Methodology ..................................................... 15 4.2 Airflow Characterization ..................................................................................... 17 ATX Reference Thermal Solution.............................................................................. 19 5.1 Operating Environment ...................................................................................... 19 5.2 Board-Level Components Keepout Dimensions ...................................................... 22 5.3 Reference Heatsink Thermal Solution Assembly..................................................... 23 5.4 Mechanical Design Envelope ............................................................................... 23 5.4.1 Extruded Heatsink Profiles....................................................................... 23 5.4.2 Heatsink Orientation............................................................................... 23 5.4.3 Thermal Interface Material....................................................................... 23 5.4.4 Heatsink Clip ......................................................................................... 24 5.4.5 Anchor.................................................................................................. 24 5.5 Reliability Guidelines.......................................................................................... 25 5.6 Alternate Heatsink Thermal Solution Assembly ...................................................... 25 5.7 Alternate Heatsink Mechanical Design Envelope..................................................... 27 5.7.1 Extruded Heatsink Profiles....................................................................... 27 5.7.2 Heatsink Clip ......................................................................................... 27 5.7.3 Anchor.................................................................................................. 28 5.7.4 Ramp Retainer....................................................................................... 28 5.7.5 Thermal Interface Material....................................................................... 28 Thermal Solution Component Suppliers ................................................................... 29 Mechanical Drawings for Package & Reference Thermal Solution ............................ 31 Mechanical Drawings for Alternate Thermal Solution............................................... 35 Thermal and Mechanical Design Guide 3 Figures 1-1 Thermal Design Process ............................................................................................. 7 2-1 IOH Package Dimensions (Top View)............................................................................ 9 2-2 IOH Package Dimensions (Side View)........................................................................... 9 2-3 IOH Package Dimensions (Bottom View)......................................................................10 2-4 Non-Critical to Function Solder Joints ..........................................................................11 4-1 Thermal Solution Decision Flow Chart..........................................................................16 4-2 Zero Degree Angle Attach Heatsink Read the full ® Intel X58 Express Chipset.