Intel® Xeon® Processor7500 Series Intel® Xeon® Processor E7- 8800/4800/2800 Product Families Thermal and Mechanical Design Guide

Intel® Xeon® Processor7500 Series 
Intel® Xeon® Processor E7- 
8800/4800/2800 Product Families 
Thermal and Mechanical Design Guide

Intel® Xeon® Processor7500 Series Intel® Xeon® Processor E7- 8800/4800/2800 Product Families Thermal and Mechanical Design Guide

April 2011 Reference Number: 323342-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL ...DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel Xeon Processor 7500 Series, Intel® Xeon® processor E7-8800/4800/2800 product families and LGA1567 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see http://www.intel.com/technology/turboboost. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries. * Other brands and names may be claimed as the property of others. Copyright © 2007-2011, Intel Corporation. 2 Thermal Mechanical Design Guide Contents 1 2 3 4 5 Introduction ..............................................................................................................9 1.1 References ....................................................................................................... 10 1.2 Definition of Terms............................................................................................ 10 LGA1567 Socket ...................................................................................................... 13 2.1 Mechanical Requirements ................................................................................... 13 2.1.1 Attachment to Printed Circuit Board (PCB) ................................................. 13 2.1.2 Pad Dimensions ..................................................................................... 14 2.1.3 LGA1567 Socket NCTF Solder Joints.......................................................... 14 2.1.4 Socket Loading and Deflection Specifications.............................................. 15 2.1.5 Clarification of Static Compressive Load Values .......................................... 16 2.1.6 Critical-to-Function Interfaces.................................................................. 16 2.1.7 Pick-and-Place and Handling Cover........................................................... 17 2.1.8 Socket Housing Material.......................................................................... 18 2.1.9 Socket Markings..................................................................................... 18 2.1.10 Solder Ball Characteristics ....................................................................... 18 2.2 Maximum Socket Temperature............................................................................ 19 2.3 Electrical Requirements...................................................................................... 19 Independent Loading Mechanism (ILM)................................................................... 21 3.1 Allowable Board Thickness.................................................................................. 21 3.2 Description of ILM Versions................................................................................. 21 3.3 ILM Assembly ................................................................................................... 22 3.4 ILM Back Plate Assembly.................................................................................... 23 3.5 ILM Load Specifications...................................................................................... 24 3.6 ILM Cover ........................................................................................................ 24 3.6.1 HL-ILM Cover ........................................................................................ 25 3.6.2 LP-ILM Cover......................................................................................... 25 3.7 Components Assembly....................................................................................... 26 Processor Thermal Solutions ................................................................................... 29 4.1 Processor Thermal Targets ................................................................................. 29 4.2 Mechanical Targets............................................................................................ 29 4.2.1 Package/Socket Stackup Height ............................................................... 30 4.2.2 Mechanical Parameters ........................................................................... 30 4.3 Intel Reference Design Heat Sink ........................................................................ 31 4.3.1 Allowable Board Thickness....................................................................... 31 4.3.2 Tower Heatsink Performance.................................................................... 31 Read the full Intel® Xeon® Processor7500 Series Intel® Xeon® Processor E7- 8800/4800/2800 Product Families Thermal and Mechanical Design Guide.

Related Videos