Intel® MAX® 10 FPGA

Intel® MAX® 10 FPGAs revolutionize non-volatile integration by delivering advanced processing capabilities in a single chip small form factor programmable logic device for low power and cost-sensitive applications. Building upon the single chip heritage of previous MAX® device families, densities range from 2K-50K LEs, using either single or dual-core voltage supplies. The Intel® MAX® 10 FPGA family encompasses both advanced small wafer scale packaging (3 mm x 3 mm) and high I/O pin count packages offerings.

Intel® MAX® 10 FPGAs are built on TSMC's 55 nm embedded NOR flash technology, enabling instant-on functionality. Integrated features include analog-to-digital converters (ADCs) and dual configuration flash allowing you to store and dynamically switch between two images on a single chip. Unlike CPLDs, Intel® MAX® 10 FPGAs also include full-featured FPGA capabilities, such as Nios® II soft core embedded processor support, digital signal processing (DSP) blocks, and soft DDR3 memory controllers.

See also: Intel® MAX® 10 FPGA Design SoftwareDesign Store, Downloads, Community, and Support.

Intel® MAX® 10 FPGA


  • Up to 50,000 logic elements (LEs).
  • Up to 500 user I/O pins.
  • Non-volatile instant-on architecture.
  • Single chip.
  • Packages as small as 3x3 mm2.
  • Embedded SRAM.
  • DSP blocks.
  • High-performance phase-locked loops (PLLs) and low-skew global clocks.
  • External memory interface (DDR3 SDRAM/DDR3L SDRAM/DDR2 SDRAM/LPDDR2).
  • Nios® II soft core embedded processor support.
  • 3.3 V, LVDS, PCI*, and 30+ other I/O standards supported.
  • Embedded SAR ADCs – 12 bit, 1 Mbps.
  • Up to 18 analog input channels.
  • Temperature sensor.
  • Single or dual-core voltage supply offering.
  • Embedded flash.
  • Dual configuration flash.
  • User flash memory.
  • Internal oscillator.
  • Power-saving features.
  • Sleep mode to reduce dynamic power by up to 95%.
  • Input buffer power-down.
  • 128 bit Advanced Encryption Standard (AES) and other design security features.
  • RoHS6 packaging.

Qualification and Certification

Intel® MAX® 10 FPGAs are available in commercial, industrial, and automotive (AEC-Q100) temperature grades.

In addition, they will be supported in a future release of the functional safety pack, TUV Certified to IEC 61508 and ISO 26262, reducing development time and time to market.

Control Center

Intel® MAX® 10 FPGAs – Your Control Center

Why have a separate Power Management IC (PMIC) to control your systems, when you can get one Intel® MAX® 10 FPGA that does it all. MAX 10 FPGAs integrate comprehensive Board Management Controller (BMC) capabilities, reducing component count and cost relative to stand-alone solutions.

Many of today’s high-end FPGAs, including Intel® Arria® 10 FPGAs and SoCs and Intel® Stratix® 10 FPGAs and SoCs, have multiple power rails that need to be turned on a in a specific order and monitored during runtime to ensure proper device operation. Whether the power supplies used for these FGPAs are controlled by simple digital I/O or leverage the more advanced PMBus control interface, MAX 10 FPGAs are well equipped to sequence and monitor these power supplies.

Benefits of Using Intel® MAX® 10 FPGAs Over PMICs

MIPI for Video

Next generation video solutions, such as industrial surveillance cameras, industrial machine vision, automotive (gesture control, self-driving cars, advanced driver assistance system (ADAS) and consumer drones require more advanced video processing capabilities. Intel® MAX® 10 FPGAs, combined with IP cores, provide one of the industry’s best solutions to implement many of these interfaces:

  • Control or Data Centric Interfaces.
  • CAN*, LIN*, Ethernet (AVB/BRR*/TSN), USB*, PCI-Express*.
  • Camera Sensor or Video Interfaces.
  • MIPI* CSI or DSI, HiSPi*, SLVS, DisplayPort*, RSDS/LVDS/mini-LVDS.