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Technical Specifications

Essentials

Capacity
6.4 TB
Status
Launched
Launch Date
Q2'19
Lithography Type
64-Layer 3D TLC NAND
Use Conditions
Server/Enterprise

Performance

Sequential Read (up to)
6650 MB/s
Sequential Write (up to)
5350 MB/s
Random Read (100% Span)
1210000 IOPS
Random Write (100% Span)
484000 IOPS
Latency - Read
80 µs
Latency - Write
20 µs
Power - Active
29W
Power - Idle
10W

Reliability

Vibration - Operating
2.17G
Vibration - Non-Operating
3.13G
Shock (Operating and Non-Operating)
1000G
Operating Temperature Range
0°C to 70°C
Endurance Rating (Lifetime Writes)
53.35 PBW
Mean Time Between Failures (MTBF)
2 million hours
Uncorrectable Bit Error Rate (UBER)
1 sector per 10^-17 bits read
Warranty Period
5 yrs

Package Specifications

Weight
190g
Form Factor
HHHL (CEM3.0)
Interface
PCIe NVMe 3.0 x8

Advanced Technologies

Enhanced Power Loss Data Protection
Yes
Hardware Encryption
AES 256 bit
High Endurance Technology (HET)
Yes
Temperature Monitoring and Logging
Yes
End-to-End Data Protection
Yes

Reviews

Product and Performance Information

This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.