Intel® Stratix® 10 FPGA Features

To address the challenges presented by next-generation systems, Intel® Stratix® 10 FPGAs and SoCs feature the new Intel® Hyperflex™ FPGA Architecture, which delivers 2X the clock frequency performance and up to 70% lower power compared to previous-generation, high-end FPGAs.¹

Intel® Hyperflex™ FPGA Architecture Overview White Paper

Learn how the Intel® Hyperflex™ FPGA Architecture for Intel® Stratix® 10 devices delivers breakthroughs for next-generation systems.

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The Intel® Hyperflex™ FPGA Architecture introduces additional bypassable registers everywhere throughout the FPGA fabric. These additional registers, called Hyper-Registers, are available on every interconnect routing segment and at the inputs of all functional blocks. Hyper-Registers enable three key design techniques to achieve the 2X core performance increase:

• Fine grained Hyper-Retiming to eliminate critical paths.
• Zero latency Hyper-Pipelining to eliminate routing delays.
• Flexible Hyper-Optimization to achieve the best performance.

When you use these techniques in your design, the Hyper-Aware design tools automatically use the Hyper-Registers to achieve maximum core clock frequency.

Intel® Hyperflex™ FPGA Architecture in Intel® Stratix® 10 Devices

Learn About Intel® Hyperflex™ FPGA Architecture Features

Intel® Hyperflex™ FPGA Architecture Hardware Design White Paper

Learn how the Intel® Hyperflex™ FPGA Architecture innovations help designers achieve their performance goals.

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Intel® Hyperflex™ FPGA Architecture Design Software White Paper

Learn how the Intel® Hyperflex™ FPGA Architecture design software innovations reduce design iterations and increase designer productivity for fast time to market.

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Optimize Designs with the Intel® Hyperflex™ FPGA Architecture

The Intel® Hyperflex™ FPGA Architecture enables three key design techniques to achieve 2X performance: Hyper-Retiming, Hyper-Pipelining, and Hyper-Optimization. Read the Intel® Stratix® 10 device High-Performance Design Handbook to learn how to combine these performance optimization techniques to achieve the highest clock frequencies in Intel® Stratix® 10 devices.

Intel® Stratix® 10 High-Performance Design Handbook

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Start Designing with the Intel® Hyperflex™ FPGA Architecture Today

The Intel® Hyperflex™ FPGA Architecture leverages the Hyper-Aware design flow. This flow incorporates the innovative Fast Forward Compile feature that allows designers to perform rapid design performance exploration and attain breakthrough levels of performance.

The Fast Forward Compile feature is available today, so you can start designing with the Intel® Hyperflex™ FPGA Architecture for Intel® Stratix® 10 devices. Contact your sales representative to obtain a license.

Contact your local sales representative about evaluating the Fast Forward Compile feature.

Watch the Fast Forward Compile Feature Demo Video

Watch this demo video about the Fast Forward Compile feature for Intel® Stratix® 10 device designs. This video shows you how the Fast Forward Compile feature provides innovative performance exploration capabilities and implement the three key design optimizations for the Intel® Hyperflex™ FPGA Architecture, including:

• How to overcome retiming restrictions to enable Hyper-Retiming.
• How to optimize designs to implement Hyper-Pipelining.
• How to identify and overcome performance bottlenecks for Hyper-Optimization.
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Register for Training on the Intel® Hyperflex™ FPGA Architecture

Intel offers instructor-led training and online training courses covering design optimization techniques to extract the maximum performance from your design using the Intel® Hyperflex™ FPGA Architecture.

Register now to schedule instructor-led training or to View free online training now.

Intel® Stratix® 10 FPGAs and SoCs leverage heterogeneous 3D system-in-package (SiP) technology to integrate a monolithic FPGA core fabric with 3D SiP transceiver tiles and other advanced components in a single package. Read the Enabling Next-Generation Platforms Using Intel's 3D System-in-Package Technology White Paper (PDF).

Scalable and Flexible Solutions

Heterogeneous 3D SiP integration enables a scalable and flexible path to deliver multiple product variants that mix functionality and/or process nodes effectively within a single package.

Mixing Functionality and Process Nodes

Heterogeneous 3D SiP integration enables a number of major system-level benefits including:

• High Performance: Heterogeneous integration provides a path to integrate higher bandwidth interface capabilities to meet the needs of 400-Gigabit to 1-Terabit systems.
• Lower Power: Compared to discrete components on a PCB, heterogeneous integration reduces the amount of power spent on driving long interconnect to deliver an overall lower power solution.
• Smaller Form Factor: By integrating discrete components in a single package, overall solution size can be decreased significantly including less board area used for routing.

Intel EMIB Packaging Technology for Intel® Stratix® 10 Devices

Intel’s patented Embedded Multi-Die Interconnect Bridge (EMIB) technology enables effective in-package integration of system-critical components, such as analog, memory, ASICs, CPU, and so on. EMIB technology offers a simpler manufacturing flow, compared to other in-package integration technologies. Additionally, EMIB eliminates the need to use through silicon vias (TSV) and specialized interposer silicon enabling a solution that offers higher performance, less complexity, and superior signal and power integrity. EMIB uses a small silicon chip embedded in the substrate to provide ultra-high density interconnect between die. Standard flip chip assembly connects power and user signals from the chip to package balls. This approach minimizes interference from core switching noise and crosstalk to deliver superior signal and power integrity.

For details on the specific implementation of this technology on the upcoming Intel® Stratix® 10 device family, see the Transceivers section.

Learn More About Heterogeneous 3D SiP Integration

Download this white paper to learn more about how Intel® Stratix® 10 FPGAs and SoCs leverage heterogeneous 3D SiP integration to deliver performance, power, and form factor breakthroughs while providing greater scalability and flexibility. In addition, learn how Intel EMIB technology delivers a superior solution for multi-die integration.

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Intel® Stratix® 10 FPGAs and SoCs deliver a new era of transceiver technology with the introduction of innovative heterogeneous 3D system-in-package (SiP) transceivers. Transceiver tiles are combined with a monolithic programmable core fabric using system-in-package integration to address ever-increasing system bandwidth demands across virtually all market segments. Transceiver tiles enable the highest transceiver channel count FPGA without sacrificing ease-of-use.

Intel® Stratix® 10 devices provide memory interface support, including serial and parallel interfaces.

The Intel® Stratix® 10 device family introduces a new Secure Device Manager (SDM) available in all densities and device family variants. Serving as the central command center for the entire FPGA, the Secure Device Manager controls key operations, such as configuration, device security, single event upset (SEU) responses, and power management. The Secure Device Manager creates a unified, secure management system for the entire device, including the FPGA fabric, hard processor system (HPS) in SoCs, embedded hard IP blocks, and I/O blocks. Read the Intel® Stratix® 10 Secure Device Manager Provides Best-in-Class FPGA and SoC Security White Paper (PDF).

Secure Device Manager Key Benefits

User-Configurable Boot Process

With a dedicated processor managing configuration, Intel® Stratix® 10 FPGA users can control the configuration order of the core logic in the FPGA or SoC. You can also select whether the FPGA design or the processor application boots up first, and whether the first system manages the configuration control of the second. The Secure Device Manager allows greater flexibility and user-selected configuration control compared to previous-generation FPGAs and SoCs.

User-Scripted Response to SEU and Tamper Detection

You can control the FPGA or SoC responses to SEU and tamper detection, using a dedicated processor in the Secure Device Manager. Intel® Stratix® 10 devices also support user-scripted device erasure, where reactive data zeroization serves a security response.

Physically Unclonable Function for Key Material and Identity

Intel® Stratix® 10 devices enable user-access to a Physically Unclonable Function (PUF) that provides unique device fingerprinting for device identification. It also serves as a secure key material for device encryption and authentication.

Anti-Tamper Protection

Intel® Stratix® 10 devices include on-chip temperature sensors and device voltage rail monitors to detect tamper attacks on the FPGA or SoC. Additionally, the secure processor in the Secure Device Manager lets you update the configuration process. You can deploy a different configuration order or updated encryption processes in the field if a particular configuration process is found to be ineffective against the threat profile.

Advanced Key Management Schemes

You can select different keys to encrypt various sections of the FPGA core (sectors). You can also design different key handling procedures for keys at different security or sensitivity levels. A key can be used across multiple sectors or a single sector to reduce the vulnerability of the entire design.

Additionally, you can update/retire/replace keys in the user key space and generate keys to include public and private key pairs within the FPGA or SoC. Private keys are not revealed outside the Secure Device Manager.

Comprehensive and Hardened Encryption and Authentication

Intel® Stratix® 10 FPGAs and SoCs enable user-access to hard IP encryption and authentication accelerators. Supported accelerators include:

• AES 256 Encrypt/Decrypt Accelerator.
• SHA2 256/384 Accelerator.
• ECDSA 256/384 Accelerator.

You can use these accelerators for configuration and reconfiguration processes and user-defined encryption and authentication processes post-configuration.

Some hard IP encryption and authentication accelerators may be subject to appropriate user licensing.

Advanced Device Management

The user and command authentication capabilities of the Secure Device Manager also enable a whole class of new secure device maintenance functions for the Intel® Stratix® 10 device family. These functions include:

• Secure remote update (authenticated).
• Secure return material authorization (RMA) of devices without revealing user keys.
• Secure debug of designs and ARM* processor code.
• Secure key management.

Secure Device Manager Block Diagram

Learn More

Download this white paper to learn how the Secure Device Manager enable Intel® Stratix® 10 FPGAs and SoCs to deliver a security solution.

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With Intel® Stratix® 10 devices, digital signal processing (DSP) designs can achieve up to 10 tera floating-point operations per second (TFLOPS) of IEEE 754 single-precision floating-point operations. This unprecedented degree of computational throughput is made possible by a hardened floating-point operators within each DSP block. It is initially introduced in the Intel® Arria® 10 device family and now extended to deliver an order of magnitude greater throughput in Intel® Stratix® 10 FPGAs and SoCs. Read the Intel® Stratix® 10 FPGA and SoC DSP backgrounder.

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Intel® Stratix® 10 Device DSP Block: Standard-Precision Fixed Point

Intel® Stratix® 10 Device DSP Block: High-Precision Fixed Point

Intel® Stratix® 10 Device DSP Block: Single-Precision Floating Point

Unprecedented Performance

Intel® Stratix® 10 devices deliver up to 23 TMACs of fixed-point performance and up to 10 TFLOPS of IEEE-754 single-precision floating-point performance

Breakthrough Peformance per Watt Efficiency

In addition to high performance, Intel® Stratix® 10 devices can achieve power efficiency of up to 80 GFLOPS/Watt. This level of floating-point power efficiency is a significant innovation for the floating-point processing industry delivering performance at a fraction of the power of alternative computing elements.

Optimized and Integrated Design Entry

Designing with floating-point operations is achievable via a number of design flows including:

• Intel® FPGA IP cores
• DSP Builder for Intel® FPGAs model-based design flow
• OpenCL™ C-based design flow
• HDL templates in Verilog HDL and VHDL.

Learn More About DSP in Intel® Stratix® 10 FPGAs and SoCs

Learn about DSP block architecture in Intel® Stratix® 10 FPGAs and SoCs and the productivity benefits of hardened floating-point DSP blocks by downloading the DSP backgrounder.

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Learn more about designing filters for high performance using Intel® Stratix® 10 devices.

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Using Intel® Stratix® 10 NX FPGA, AI acceleration designs can achieve up to 15X more INT8² throughput than standard Intel® Stratix® 10 FPGA DSP Block. This computational throughput is made possible by a new type of AI-optimized computation block called the AI Tensor Block. The AI Tensor Block contains dense arrays of lower-precision multipliers typically used in AI applications. The AI Tensor Block’s architecture is tuned for common matrix-matrix or vector-matrix multiplications used in a wide range of AI computations, with capabilities designed to work efficiently for both small and large matrix sizes.

Intel® Stratix® 10 NX FPGA AI Tensor Block

The AI Tensor Block multipliers have base precisions of INT8 and INT4 and support FP16 and FP12 numerical formats through shared-exponent support hardware. All additions or accumulations can be performed with INT32 or IEEE754 single-precision floating point (FP32) precision and multiple AI Tensor Block can be cascaded together to support larger matrices.

Single-event upsets (SEUs) are rare, unintended changes in the state of internal memory elements caused by radiation effects. The change in state results in a soft error and there is no permanent damage to the device.

Intel® Stratix® 10 devices have intrinsically low upset rates as a result of the high SEU immunity provided by Intel's 14 nm Tri-Gate process. Additionally, Intel provides fine-grained capability for determining where an upset occurred in your design so you can design your system to have the appropriate response.

Intel® Stratix® 10 FPGAs and SoCs ensure high reliability and provides SEU mitigation capabilities.

• Advanced SEU Detection (ASD).
  • Sensitivity processing.
  • Hierarchy tagging.
• Fault injection.
  • Use to characterize and improve your designs.

Learn More:

• Mitigating Single-Event Upsets
• Intel Advanced SEU Detection (INTEL_ADV_SEU_DETECTION) IP Core User Guide
• Debugging Single-Event Upsets Using the Fault Injection Debugger
• Introduction to Single-Event Upsets (PDF)
• Understanding Single-Event Functional Interrupts in FPGA Designs (PDF)

Building on Intel’s leadership in SoCs, Intel® Stratix® 10 SoCs include a next-generation hard processor system (HPS) to deliver the industry’s highest performance and most power-efficient SoCs. At the heart of the HPS is a highly efficient quad-core ARM* Cortex*-A53 processor cluster. This processor is optimized for ultra-high performance per watt, which reduces power consumption up to 50% over previous-generation SoC FPGAs. Additionally, the HPS includes a System Memory Management Unit, Cache Coherency Unit, a hard memory controller, and a rich feature set of embedded peripherals.

Quad-Core ARM Cortex-A53-Based HPS

Intel® Stratix® 10 SoC Development Tools

The Intel® SoC FPGA Embedded Development Suite (SoC EDS) featuring ARM* Development Studio* 5 (DS- 5*) supports Intel® Stratix® 10 SoCs, providing heterogeneous debug, profiling, and whole-chip visualization. The SoC EDS unifies all software debugging information from the CPU and FPGA domains and presents them in an organized fashion within the standard DS-5 user interface. The toolkit gives users an unprecedented level of debugging visibility and control that delivers substantial productivity gains.

To learn more, visit the Intel® Stratix® 10 SoC page.