Product Collection
Status
Launched
Launch Date
Q1'18
Lithography
14 nm

Resources

Logic Elements (LE)
2073000
Adaptive Logic Modules (ALM)
702720
Adaptive Logic Module (ALM) Registers
2810880
Fabric and I/O Phase-Locked Loops (PLLs)
16
Maximum Embedded Memory
239.5 Mb
Digital Signal Processing (DSP) Blocks
3960
Digital Signal Processing (DSP) Format
Multiply and Accumulate, Variable Precision, Fixed Point (hard IP), Floating Point (hard IP)
Hard Memory Controllers
Yes
External Memory Interfaces (EMIF)
DDR4, DDR3, DDR2, DDR, QDR II, QDR II+, RLDRAM II, RLDRAM 3, HMC, MoSys

I/O Specifications

Maximum User I/O Count
440
I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3V LVCMOS, SSTL, POD, HSTL, HSUL, Differential SSTL, Differential POD, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL
Maximum LVDS Pairs
216
Maximum Non-Return to Zero (NRZ) Transceivers
96
Maximum Non-Return to Zero (NRZ) Data Rate
28.9 Gbps
Maximum Pulse-Amplitude Modulation (PAM4) Transceivers
36
Maximum Pulse-Amplitude Modulation (PAM4) Data Rate
57.8 Gbps
Transceiver Protocol Hard IP
PCIe Gen3, 10/25/100G Ethernet

Advanced Technologies

Hyper-Registers
Yes
FPGA Bitstream Security
Yes

Package Specifications

Package Options
F2397

Supplemental Information

Additional Information