Guide: This document addresses the surface mount technology (SMT) board assembly process including reflow soldering SMT components to boards, replacing individual components on assembled boards, and samples of rework profiles.
Demos removing and replacing damaged ball grid array socket components for motherboard repair.
Chen Han Lim demos a solution that collects machine data in a mobile app for manufacturing efficiency.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.