Guide: This document addresses the surface mount technology (SMT) board assembly process including reflow soldering SMT components to boards, replacing individual components on assembled boards, and samples of rework profiles.
Chen Han Lim demos a solution that collects machine data in a mobile app for manufacturing efficiency.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Guide to LGA1567 socket independent loading mechanism installation for minimized contact damage.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.