Recommended Thermal Interface Material (TIM) for the Intel® Xeon® Scalable Processors

Documentation

Compatibility

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09/02/2021

Honeywell* Thermal Interface Material PCM45F (Supplier Part Number 099079) with dimensions 70x47x0.25mm is the recommended thermal interface material to use with Intel® Xeon® Scalable Processors that support the LGA3647 socket. This information also applies to Intel® Xeon® W Processors that support the same socket.

Note
  • Third-party part numbers and availability are subject to change.
  • For help on availability, contact Honeywell or your processor distributor/reseller.
  • Honeywell's minimum order quantity is 1000 units for the PCM45F. Third-party resellers may sell smaller quantities of this material but be sure to check the material's dimensions.

 

Related topics
How to Apply Thermal Interface Material (TIM) in LGA3647 Socket for Intel® Xeon® Processors
Installing an LGA3647 Socket on Intel® Xeon® Processors
Intel® Xeon® Processor Scalable Family - Thermal Mechanical Specifications and Design Guide
Sockets Supported by Intel® Xeon® Processors