Agilex™ 7 Hard Processor System Technical Reference Manual

ID 683567
Date 4/22/2024
Public
Document Table of Contents

6. System Interconnect

The components of the hard processor system (HPS) communicate with one another, and with other portions of the SoC device, through the system interconnect. The system interconnect consists of the following blocks:

  • Layer 3 (L3) Interconnect

    It is a high performance tier of the interconnect that provides high-bandwidth routing between masters and slaves in the HPS.

  • Layer 4 (L4) Interconnect

    It is a lower performance tier of the interconnect that handles data traffic for low- to mid-level bandwidth slave peripherals.

The system interconnect is a highly efficient packet-switched network that supports high-throughput traffic. The system interconnect is the main communication bus for the MPU and all hard IP cores in the SoC device.

The system interconnect supports the following features:

  • Configurable Arm* TrustZone* -compliant firewall and security support.
    • For each peripheral, implements secure or non-secure access.
    • Allows configuration of individual transactions as secure or non-secure at the initiating master.
  • Multi-tiered bus structure to separate high bandwidth masters from lower bandwidth peripherals and control and status ports.
  • Quality of service (QoS) with three programmable levels of service on a per-master basis.
  • On-chip debugging and tracing capabilities.

The system interconnect is based on the Arteris® FlexNoC™ network-on-chip (NoC) interconnect technology.