Visible to Intel only — GUID: sam1403481935742
Ixiasoft
1. Logic Array Blocks and Adaptive Logic Modules in Intel® Cyclone® 10 GX Devices
2. Embedded Memory Blocks in Intel® Cyclone® 10 GX Devices
3. Variable Precision DSP Blocks in Intel® Cyclone® 10 GX Devices
4. Clock Networks and PLLs in Intel® Cyclone® 10 GX Devices
5. I/O and High Speed I/O in Intel® Cyclone® 10 GX Devices
6. External Memory Interfaces in Intel® Cyclone® 10 GX Devices
7. Configuration, Design Security, and Remote System Upgrades in Intel® Cyclone® 10 GX Devices
8. SEU Mitigation for Intel® Cyclone® 10 GX Devices
9. JTAG Boundary-Scan Testing in Intel® Cyclone® 10 GX Devices
10. Power Management in Intel® Cyclone® 10 GX Devices
2.1. Types of Embedded Memory
2.2. Embedded Memory Design Guidelines for Intel® Cyclone® 10 GX Devices
2.3. Embedded Memory Features
2.4. Embedded Memory Modes
2.5. Embedded Memory Clocking Modes
2.6. Parity Bit in Embedded Memory Blocks
2.7. Byte Enable in Embedded Memory Blocks
2.8. Memory Blocks Packed Mode Support
2.9. Memory Blocks Address Clock Enable Support
2.10. Memory Blocks Asynchronous Clear
2.11. Memory Blocks Error Correction Code Support
2.12. Embedded Memory Blocks in Intel® Cyclone® 10 GX Devices Revision History
3.4.1. Input Register Bank
3.4.2. Pipeline Register
3.4.3. Pre-Adder for Fixed-Point Arithmetic
3.4.4. Internal Coefficient for Fixed-Point Arithmetic
3.4.5. Multipliers
3.4.6. Adder
3.4.7. Accumulator and Chainout Adder for Fixed-Point Arithmetic
3.4.8. Systolic Registers for Fixed-Point Arithmetic
3.4.9. Double Accumulation Register for Fixed-Point Arithmetic
3.4.10. Output Register Bank
4.2.1. PLL Usage
4.2.2. PLL Architecture
4.2.3. PLL Control Signals
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Programmable Phase Shift
4.2.7. Programmable Duty Cycle
4.2.8. PLL Cascading
4.2.9. Reference Clock Sources
4.2.10. Clock Switchover
4.2.11. PLL Reconfiguration and Dynamic Phase Shift
5.1. I/O and Differential I/O Buffers in Intel® Cyclone® 10 GX Devices
5.2. I/O Standards and Voltage Levels in Intel® Cyclone® 10 GX Devices
5.3. Intel FPGA I/O IP Cores for Intel® Cyclone® 10 GX Devices
5.4. I/O Resources in Intel® Cyclone® 10 GX Devices
5.5. Architecture and General Features of I/Os in Intel® Cyclone® 10 GX Devices
5.6. High Speed Source-Synchronous SERDES and DPA in Intel® Cyclone® 10 GX Devices
5.7. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 GX Devices
5.8. I/O and High Speed I/O in Intel® Cyclone® 10 GX Devices Revision History
5.5.1. I/O Element Structure in Intel® Cyclone® 10 GX Devices
5.5.2. Features of I/O Pins in Intel® Cyclone® 10 GX Devices
5.5.3. Programmable IOE Features in Intel® Cyclone® 10 GX Devices
5.5.4. On-Chip I/O Termination in Intel® Cyclone® 10 GX Devices
5.5.5. External I/O Termination for Intel® Cyclone® 10 GX Devices
5.5.4.1. RS OCT without Calibration in Intel® Cyclone® 10 GX Devices
5.5.4.2. RS OCT with Calibration in Intel® Cyclone® 10 GX Devices
5.5.4.3. RT OCT with Calibration in Intel® Cyclone® 10 GX Devices
5.5.4.4. Dynamic OCT
5.5.4.5. Differential Input RD OCT
5.5.4.6. OCT Calibration Block in Intel® Cyclone® 10 GX Devices
5.6.1. Intel® Cyclone® 10 GX LVDS SERDES Usage Modes
5.6.2. SERDES Circuitry
5.6.3. SERDES I/O Standards Support in Intel® Cyclone® 10 GX Devices
5.6.4. Differential Transmitter in Intel® Cyclone® 10 GX Devices
5.6.5. Differential Receiver in Intel® Cyclone® 10 GX Devices
5.6.6. PLLs and Clocking for Intel® Cyclone® 10 GX Devices
5.6.7. Timing and Optimization for Intel® Cyclone® 10 GX Devices
5.6.6.1. Clocking Differential Transmitters
5.6.6.2. Clocking Differential Receivers
5.6.6.3. Guideline: LVDS Reference Clock Source
5.6.6.4. Guideline: Use PLLs in Integer PLL Mode for LVDS
5.6.6.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only
5.6.6.6. Guideline: Pin Placement for Differential Channels
5.6.6.7. LVDS Interface with External PLL Mode
5.7.1. I/O and High-Speed I/O General Guidelines for Intel® Cyclone® 10 GX Devices
5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards
5.7.3. Guideline: Maximum Current Driving I/O Pins While Turned Off and During Power Sequencing
5.7.4. Guideline: Maximum DC Current Restrictions
5.7.5. Guideline: LVDS SERDES IP Core Instantiation
5.7.6. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode
5.7.7. Guideline: Minimizing High Jitter Impact on Intel® Cyclone® 10 GX GPIO Performance
5.7.8. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
6.1. Key Features of the Intel® Cyclone® 10 GX External Memory Interface Solution
6.2. Memory Standards Supported by Intel® Cyclone® 10 GX Devices
6.3. External Memory Interface Widths in Intel® Cyclone® 10 GX Devices
6.4. External Memory Interface I/O Pins in Intel® Cyclone® 10 GX Devices
6.5. Memory Interfaces Support in Intel® Cyclone® 10 GX Device Packages
6.6. External Memory Interface IP Support in Intel® Cyclone® 10 GX Devices
6.7. External Memory Interface Architecture of Intel® Cyclone® 10 GX Devices
6.8. External Memory Interfaces in Intel® Cyclone® 10 GX Devices Revision History
7.1. Enhanced Configuration and Configuration via Protocol
7.2. Configuration Schemes
7.3. Configuration Details
7.4. Remote System Upgrades Using Active Serial Scheme
7.5. Design Security
7.6. Configuration, Design Security, and Remote System Upgrades in Intel® Cyclone® 10 GX Devices Revision History
9.1. BST Operation Control
9.2. I/O Voltage for JTAG Operation
9.3. Performing BST
9.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry
9.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing
9.6. IEEE Std. 1149.1 Boundary-Scan Register
9.7. IEEE Std. 1149.6 Boundary-Scan Register
9.8. JTAG Boundary-Scan Testing in Intel® Cyclone® 10 GX Devices Revision History
10.1. Power Consumption
10.2. Programmable Power Technology
10.3. Power Sense Line
10.4. Voltage Sensor
10.5. Temperature Sensing Diode
10.6. Power-On Reset Circuitry
10.7. Power Sequencing Considerations for Intel® Cyclone® 10 GX Devices
10.8. Power Supply Design
10.9. Power Management in Intel® Cyclone® 10 GX Devices Revision History
Visible to Intel only — GUID: sam1403481935742
Ixiasoft
5.1. I/O and Differential I/O Buffers in Intel® Cyclone® 10 GX Devices
The general purpose I/Os (GPIOs) consist of LVDS I/O and 3 V I/O banks:
- LVDS I/O bank—supports differential and single-ended I/O standards up to 1.8 V. The LVDS I/O pins form pairs of true differential LVDS channels. Each pair supports a parallel input/output termination between the two pins. You can use each LVDS channel as transmitter only or receiver only. Each LVDS channel supports transmit SERDES and receive SERDES with DPA circuitry. For example, you use 10 channels of the available 24 channels as transmitters. Of the remaining channels, you can use 13 channels as receivers and one channel for the reference clock.
- 3 V I/O bank—supports single-ended and differential SSTL, HSTL, and HSUL I/O standards up to 3 V. Single-ended I/O within this I/O bank support all programmable I/O element (IOE) features except:
- Programmable pre-emphasis
- RD on-chip termination (OCT)
- Calibrated RS and RT OCT
- Internal VREF generation
Intel® Cyclone® 10 GX devices support LVDS on all LVDS I/O banks:
- All LVDS I/O banks support true LVDS input with RD OCT and true LVDS output buffer.
- The devices do not support emulated LVDS channels.
- The devices support both single-ended and differential I/O reference clock for the I/O PLL that drives the SERDES.
Related Information