AN 672: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission

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ID 683624
Date 1/29/2020
Public
Document Table of Contents
Document Table of Contents x
1. AN 672: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission
1. AN 672: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission x
1.1. PCB Material Selection 1.2. Stackup Design 1.3. Channel Design 1.4. Summary 1.5. Document Revision History for the AN 672: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission
1.1. PCB Material Selection x
1.1.1. Loss Tangent and Dissipation Factor 1.1.2. Dielectric Constant 1.1.3. Fiberglass Weave 1.1.4. Copper Surface Roughness
1.3. Channel Design x
1.3.1. BGA Channel Breakout 1.3.2. Channel Routing Design 1.3.3. Edge Coupling 1.3.4. Broadside Coupling 1.3.5. Transparent Via Design 1.3.6. Blocking Cap Optimization 1.3.7. Connectors Optimization
1.3.2. Channel Routing Design x
1.3.2.1. Trace Width Selection 1.3.2.2. Loose vs. Tight Coupled Traces 1.3.2.3. Crosstalk Control
1.4. Summary x
1.4.1. PCB Material Selection 1.4.2. Stackup Design 1.4.3. Channel Design 1.4.4. References
1. AN 672: Transceiver Link Design Guidelines for High-Gbps Data Rate Transmission

1.1. PCB Material Selection

The printed circuit board (PCB) material is the substrate upon which the channel design is constructed. It consists of the core, prepreg dielectric layers, and copper foils stacked and glued together to from the complete PCB stack-up. The dielectric and copper layers form the reference planes and routing layers for the channel design. The sources of signal attenuation resulting from the PCB material include dielectric loss, conductor loss, reflections due to mismatched impedance, and radiation loss. Losses due to radiation are usually very small and can be ignored. The remaining losses can be attributed to the various properties of the material choice. Material properties that directly affect the link performance include:

  • Loss tangent (tan(δ)/Df)
  • Dielectric constant (Er/Dk)
  • Fiberglass weave composition
  • Copper surface roughness

Section Content
Loss Tangent and Dissipation Factor
Dielectric Constant
Fiberglass Weave
Copper Surface Roughness

Level Two Title