AN 875: Intel® Stratix® 10 E-Tile PCB Design Guidelines

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ID 683262
Date 3/12/2019
Public
Document Table of Contents
Document Table of Contents x
1. Introduction 2. Platform Design Strategy for 56G PAM4 Channels 3. Document Revision History for AN 875: Intel® Stratix® 10 E-Tile PCB Design Guidelines
2. Platform Design Strategy for 56G PAM4 Channels x
2.1. Intel® Stratix® 10 E-Tile Transceiver Channel Usage Mode 2.2. Intel® Stratix® 10 E-Tile Signaling - PAM4 vs. NRZ (PAM2) 2.3. PCB Design Flow
2.3. PCB Design Flow x
2.3.1. Design Target at 56 Gbps PAM4 Standard 2.3.2. PCB Materials and Stackup Design 2.3.3. FPGA PCB Design 2.3.4. PCB Pre-Layout Simulation Phase 2.3.5. PCB Post-Layout Simulation Phase
2.3.2. PCB Materials and Stackup Design x
2.3.2.1. Insertion Loss 2.3.2.2. Return Loss 2.3.2.3. Package Loss and Crosstalk 2.3.2.4. PCB Via Design 2.3.2.5. PCB Connector 2.3.2.6. Cable Usage in PCB Design
2.3.3. FPGA PCB Design x
2.3.3.1. FPGA PCB Breakout Design and Reference 2.3.3.2. P/N De-skew Strategy on Differential Pairs 2.3.3.3. Crosstalk - NEXT and FEXT in Differential Pairs
1. Introduction
2. Platform Design Strategy for 56G PAM4 Channels
3. Document Revision History for AN 875: Intel® Stratix® 10 E-Tile PCB Design Guidelines

2.3. PCB Design Flow

The following figure shows the Signal Integrity work flow in a platform design. Some adjustments may be necessary if PCB simulations fail or do not reach the desired targets.

Figure 5. Signal Integrity Work Flow in Platform Design
Level Two Title